The flagship war in September triggered Android dual-core sniper in Apple iPhone 17 ahead of schedule – Passionategeekz –

[CNMO Technology News]Recently, Passionategeekz noticed that the digital blogger “Digital Chat Station” announced the big news on Weibo: the smartphone battlefield is about to usher in intensive new product bombing and epic flagship duels.

Revelations show that from June to July, a number of highly-watched mid-to-high-end models will be the first to debut, injecting vitality into the market. The expected appearances include the vivo X Fold5 folding screen flagship, Honor Magic V5, Redmi K80 Supreme Edition, Xiaomi MIX Flip 2 vertical folding new phone, Meizu 22 series and iQOO new products. This wave of new products will meet consumers’ diverse needs for changing phones during the summer.

After all the above mid-to-high-end models are unveiled, the true peak showdown will kick off in September. According to reports, the release pace of the two top Android flagship mobile platforms, Qualcomm Snapdragon 8 Elite 2 and MediaTek Dimensity 9500, is obviously ahead of schedule. The annual flagship phones of the two major camps will be released from September to October, with the target directly targeting the Apple iPhone 17 series, which is also expected to debut in September, and the intensity of competition has been described as “unprecedented”.

According to leaked information, the Snapdragon 8 Elite 2 will adopt Qualcomm’s second-generation self-developed Oryon CPU architecture and integrate the Adreno 840 GPU. The single-core performance target of GeekBench 6 is set at above 4,000 points, and the multi-core performance is aimed at a high score of 11,000+, with significant performance improvements.

Dimensity 9500 boldly adopts an innovative “all-large core” CPU design (1*Travis + 3*Alto + 4*Gelas core combination) and integrates an Immortalis-Drage GPU. Its AI computing power is expected to reach an astonishing 100 TOPS (trillions of operations per second), with huge potential in artificial intelligence task processing.

It is worth noting that both flagship chips will be manufactured using TSMC’s latest third-generation 3nm process technology (N3P), which is expected to achieve a double breakthrough in performance and energy efficiency.

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