Huawei Advances 5nm and 3nm Chip Production Without EUV Lithography

Huawei is making significant strides in semiconductor development by building a true 5nm production line that bypasses the need for EUV lithography, a technology controlled by Dutch company ASML and currently restricted for use by Chinese manufacturers. According to a report from UDN, Huawei’s 3nm chips have already entered the research and development phase, with production slated for 2026.

To overcome its EUV limitations, Huawei is turning to Shanghai Microelectronics (SMEE) and its SSA800 lithography machine, relying on multi-patterning techniques to match the precision of EUV-based systems. While this method is more complex and costly, it enables continued innovation in advanced chipmaking within China’s technology ecosystem.

For its 3nm chip development, Huawei is pursuing two parallel paths:

GAA (Gate-All-Around) architecture—a design approach already adopted by leading players like TSMC and Samsung.
Carbon nanotube-based chips—a futuristic technology that has successfully completed lab validation and is currently being adapted to SMIC’s production line.

Earlier this month, Huawei unveiled the MateBook Fold, featuring the Kirin X90 processor. Marketed as a 5nm chip, it’s technically built on 7nm architecture but utilizes advanced packaging to enhance performance to 5nm levels. However, the chip’s yield remains low at just 50%, significantly increasing production costs and posing challenges for scalability.

Huawei’s roadmap reflects its growing determination to push forward despite U.S. sanctions and technology barriers. As chip manufacturing advances without reliance on EUV, the company is strategically redefining China’s role in the global semiconductor industry.

For ongoing coverage on Huawei’s chip breakthroughs and Chinese semiconductor innovation, visit our Huawei section on PassionateGeekz.