Apple iPhone 18 Pro screen design major modification: Face ID realizes under-screen transformation – Passionategeekz –

[CNMO Technology News]On June 19, Passionategeekz noticed that the digital chat station exposed the latest news about Apple’s iPhone 18 Pro series.

It is reported that the iPhone 18 Pro series engineering machine is testing two new displays: 6.27 inches and 6.86 inches respectively, both adopt 1.5K resolution LTPO panels, continuing the HIAA (laser direct molding) single-hole design, and realizing the under-screen integration of Face ID components for the first time. This technological upgrade marks a breakthrough step in Apple’s screen form.

Previously, Tianfeng International analyst Ming-Chi Kuo pointed out that the iPhone 18 Pro series is expected to be equipped with A20 chip based on TSMC’s 2nm process. Compared with the second generation of 3nm process currently used by the A18 Pro, the 2nm process is expected to achieve a 15% performance improvement and 30% energy efficiency optimization. The significant increase in transistor density will bring stronger computing power support to the device.

It is worth noting that Apple’s chip iteration strategy is changing – the A19 series will adopt the third-generation 3nm process as a transition, and the advance application of the 2nm process shows its resource tilt for high-end models.

At the market strategy level, Guo Mingchi predicts that Apple will adjust its product release cycle and form a new rhythm of “mainly promoting mid-range models in the first half of the year and releasing flagship products in the second half of the year.” The roadmap disclosed at the same time shows that the mass production plan for foldable iPhones has been advanced to the second half of 2026, and the iteration cycle of foldable models will be shortened to 18 months.

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