[CNMO Technology News]According to Taiwan’s “Business Times” report, TSMC has begun to accept orders for 2nm wafers, but the first chips that use this advanced process are not expected to be unveiled until the end of 2025. Rumors say that Apple is the first to lock in the new technology as usual. Its next-generation flagship chip A20 will adopt TSMC’s 2nm process and will be the first to introduce WMC (wafer-level multi-chip module) packaging technology, bringing a double jump in performance and energy efficiency.
It is reported that the iPhone 18 Pro, iPhone 18 Pro Max and the rumored iPhone 18 Fold folding machine will become the first models of A20 chip and WMCM packages. The advantage of WMCM technology is that it can integrate multiple core components, such as CPU, GPU, memory controller, etc., in the wafer stage, and then cut into chips. Compared with traditional InFo (fan-out package) technology, WMCM is more flexible and integrated, which helps Apple achieve higher energy efficiency ratio and computing power density while keeping the chip size unchanged, especially suitable for high-end flagship models.
Rumor also pointed out that the A20 chip will be 15% faster than the A19 at the same power consumption, continuing to strengthen Apple chips’ leading edge in performance and energy consumption control. However, in terms of memory, Apple seems to be maintaining a 12GB RAM configuration, and has not yet been further improved. It is worth noting that the news does not mention whether non-Pro models such as iPhone 18 and iPhone 18 Plus will also adopt WMCM packages. Considering cost control and product positioning, Apple may continue to use the old InFo package on standard models to differentiate from the Pro series.
All rights reserved, no reproduction without permission
Discover more from PassionateGeekz
Subscribe to get the latest posts sent to your email.
